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Thermal-analysis
TMA(Thermomechanical analysis)
DMA(Dynamic Mechanical Analyzer)
rheology-Testing
UV-DSC Testing - Ultraviolet Calorimeter Testing Service
Capillary Rheology
Spectrum
UPS Testing
XPS Testing
ICP-MS(Inductively Coupled Plasma Mass)
Microscope
AFM(Atomic Force Microscope)
TEM Testing
SEM Testing
NMR_MS
SSNMR(Solid State NMR)
PYGCMS Testing
Maldi-tof Testing
Adsorption
BET(Specific surface area analyzers)
VSM Testing
Mercury Intrusion Porosimetry (MIP) Testing
Chromatogram
GPC(gel permeation chromatography)
Electrical
Vector Network Analyzer Testing
Analysis_application
Damping Coefficient(Loss Factor)
Thermal Expansion Coefficient Testing
Molecular Weight Testing
比热容测试
Chemical
Epoxy
Low-Chlorine High-Purity Bisphenol A Epoxy Resin EP-HA
High Flexibility Epoxy Resin
Curing-agent
High flexibility modified amine curing agents
Low temperatures rapid curing hardner
Super corrosion resistant modified amine
Acceralator
Substituted Urea Accelerators
Silane
3-Isocyanatopropyl trimethoxysilane
Application
Adhesive
Modified Amine Curing Agent - Ecure-17
Architecture
Fast-Curing Epoxy Metal Repair
Low-Temperature Fast-Curing Agents
Composite
Epoxy composite pipeline
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