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Thermal-analysis
TMA(Thermomechanical analysis)
DMA(Dynamic Mechanical Analyzer)
Rotational Rheometer
UV-DSC Testing-Ultraviolet Calorimeter
Capillary Rheology
Spectrum
UPS (Ultraviolet Photoelectron Spectrometry)
XPS (X-ray Photoelectron Spectroscopy)
ICP-MS (Inductively Coupled Plasma Mass)
Microscope
AFM (Atomic Force Microscope)
TEM (Transmission Electron Microscopy)
SEM (Scanning Electron Microscope )
NMR_MS
SSNMR(Solid State NMR)
Maldi-tof ( (Matrix-Assisted Laser Desorption/Ionization Time-of-Flight Mass Spectrometry) )
Adsorption
BET(Specific surface area analyzers)
VSM (Vibrating Sample Magnetometer Detection)
MIP (Mercury Intrusion Porosimetry) Testing
Chromatogram
GPC(gel permeation chromatography)
PYGCMS (Pyrolysis Chromatography-Mass Spectrometry)
Electrical
Vector Network Analyzer
Analysis_application
Damping Coefficient(Loss Factor)
Thermal Expansion Coefficient
Molecular Weight Testing
Specific Heat Capacity
Chemical
Epoxy
Low-Chlorine High-Purity Bisphenol A Epoxy Resin EP-HA
High Flexibility Epoxy Resin
Curing-agent
High flexibility modified amine curing agents
Low temperatures rapid curing hardner
Super corrosion resistant modified amine
Acceralator
Substituted Urea Accelerators
Silane
3-Isocyanatopropyl trimethoxysilane
Application
Adhesive
Modified Amine Curing Agent - Ecure-17
Architecture
Fast-Curing Epoxy Metal Repair
Low-Temperature Fast-Curing Agents
Composite
Epoxy composite pipeline
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