Thermal-analysis

TMA Testing-Thermomechanical analyzers Services-Shanghai Jituo Technology

Shanghai Jituo Technology provides TMA testing services. Static thermomechanical analysis detection can be used for measuring the coefficient of thermal expansion (CTE), crystallinity, TG, softening point, and PCB delamination time

Detailed Description

A Thermomechanical Analyzer (TMA) is a technology that studies the thermomechanical behavior of materials by measuring the relationship between deformation and temperature/time under programmed temperature control.

Basic Principle

Under a constant load (in tension, compression, bending, or penetration mode), a linear heating, cooling, or isothermal program is applied to the sample while recording the deformation-temperature/time curve. It is primarily used to characterize physical properties such as the coefficient of thermal expansion (CTE), glass transition temperature (Tg), softening point, melting point, and dimensional stability of materials, widely applied in polymer materials, ceramics, metals, composites, and other fields.

Instrument Model and Technical Parameters

  • Instrument Model: TA Q400
  • Technical Parameters:
    • Temperature range: -70 to 550°C
    • Temperature accuracy: ±0.01°C
    • Heating rate: 0.1 to 100°C/min

Sample Submission Requirements

Thickness Testing

  • Rectangular sample: 5 mm < length < 10 mm, 5 mm < width < 10 mm, 1 mm < thickness < 4 mm.
  • Cylindrical sample: 5 mm < diameter < 10 mm, 1 mm < thickness < 4 mm.

Multi-Directional Testing

  • Rectangular solid sample: 5 mm < length < 10 mm, 5 mm < width < 10 mm, 5 mm < thickness < 10 mm.

Film Tensile Testing

  • Film material: 20 mm < length < 50 mm, 2 mm < width < 3.5 mm, 0.05 mm < thickness < 0.5 mm.

Surface Flatness

  • The sample surface should be smooth and flat (can be polished with 400-grit sandpaper). The sample should have minimal internal voids and uniform material.

Testing Examples

  • TMA-PCB爆板测试-加水印.jpg
  • TMA测试膨胀系数及玻璃化温度-加水印.jpg

Related Standards

  • ISO 11359-1:1999 "Plastics - Thermomechanical analysis (TMA) - Part 1: General principles"
  • ISO 11359-2:2021 "Plastics - Thermomechanical analysis (TMA) - Part 2: Determination of linear thermal expansion coefficient and glass transition temperature"
  • ISO 11359-3:2019 "Plastics - Thermomechanical analysis (TMA) - Part 3: Determination of penetration temperature"
  • ASTM E831-23 "Standard Test Method for Linear Thermal Expansion of Solid Materials by Thermomechanical Analysis"
  • ASTM E1545-20 "Standard Test Method for Glass Transition Temperature by Thermomechanical Analysis (TMA)"
  • IEC 61189-2-805:2024 "Test Methods for Electrical Materials, Printed Circuit Boards and Other Interconnecting Structures and Components - Part 2-805: TMA Thin Substrate X/Y CTE Test"