Introduction to Ecflex Series Products
Ecflex series products are high-flexibility modified amine curing agents designed through molecular structure engineering, mainly used in two-component epoxy adhesives. Ecflex can significantly reduce the brittleness of epoxy materials, and improve the resistance to thermal shock, peel strength, and pass the double 85湿热老化 (double 85 damp heat aging) test of epoxy adhesives. In addition, the samples meet the requirements of ROHS and REACH.
Product Features
- Ultra-high flexibility, high shear strength, high peel strength
- Excellent resistance to thermal shock
- High bonding strength to various substrates and excellent peel strength
- Excellent resistance to damp heat aging
- Non-toxic and non-irritating
- Good compatibility with epoxy resins, no phase separation
Product Applications
- Electronic adhesives and electrical potting adhesives with high requirements for thermal shock resistance and damp heat aging resistance
- Thermal conductive adhesives for automotive batteries and Gap fillers for battery packs
- Epoxy structural adhesives for sandwich aluminum honeycomb panels
- Two-component structural adhesives for bonding plastics and composite materials
- Coatings and civil engineering adhesives with high crack resistance
Typical Product Properties
Curing Properties
Bonding Properties
Storage and Subsequent Handling:
Please refer to the MSDS.
Shelf Life and Storage Methods:
- Shelf life: At least 24 months from the date of production.
- The product should be sealed and stored in a cool, dark, and dry environment, and avoid prolonged contact with air and water.
- The product may crystallize when stored at low temperatures. It can be used normally after being heated and melted at 60~80℃.
