Ecure-05, Ecure-28, and Ecure-31 are low-temperature fast-curing agents, suitable for low-temperature curing epoxy adhesives used in the splicing of prefabricated components of wind power tower barrels. The structures prepared with this product are characterized by fast curing at low temperatures (-5~15°C) and achieving a certain level of high strength.
Product Features
- Fast reaction rate
- Capable of curing at temperatures as low as below zero
- High bonding strength
- Compliant with REACH and ROHS requirements
Typical Product Properties
Reference Formulation and Performance (Epoxy A/B two-component system available):
| Parameter | Ecure-28 (Component B) with Epoxy Component A | Ecure-31 (Component B) with Epoxy Component A |
|---|---|---|
| Mixing Ratio A:B (mass ratio) | 100:45 | 100:50 |
| Mixed Viscosity @25°C (mPa·s) | 4500~6500 | 2500~4500 |
| Curing Conditions | 25°C for 7 days | 25°C for 7 days |
| Gel Time for 10g (minutes) @25°C | 3~4 | 3~4 |
| Glue Climbing Height (CM) | ≤1.5 | ≤1.5 |
| Film Thread Bonding Strength | Thread breakage | Thread breakage |
| Hardness of Cured Product (Shore D) | 80~90D | 80~90D |
Storage and Subsequent Treatment Methods
- Please refer to the MSDS
Shelf Life and Storage Methods
- At least 24 months from the date of production
- The product should be stored in a sealed container in a cool, dark, and dry environment, and must be kept away from prolonged contact with air and water
- The product may crystallize when stored at lower temperatures. It can be used normally after being heated and melted at 60~80°C.
