Ecflex-07 and Ecflex-10 are high flexibility modified amine curing agents suitable for wire harness potting epoxy adhesives. Such epoxy potting adhesives exhibit excellent air tightness, mechanical properties, and bonding strength, as well as resistance to moist heat aging. Ecflex curing agents can significantly reduce the brittleness of epoxy materials, enhance the resistance of epoxy adhesives to thermal shock, improve peel strength, and pass the double 85 (moist heat) aging test. The products contain no plasticizers and comply with ROHS and REACH requirements.
Product Features
- Ultra-high flexibility, high shear strength, and high peel strength
- Excellent resistance to thermal shock
- High bonding strength to various substrates with excellent peel performance
- Excellent resistance to (moist heat) aging
- Non-toxic and non-irritating
- Good compatibility with epoxy resins without phase separation
Typical Product Properties
Post-Curing Product Properties
Storage and Subsequent Handling
Please refer to the MSDS
Storage Period and Method
- At least 24 months from the date of production
- The product should be stored in a sealed container in a cool, dark, and dry environment. Avoid prolonged exposure to air and water.
- Crystallization may occur when the product is stored at low temperatures. It can be used normally after being heated and melted at 60~80°C.
