EP-FL1, Ecflex-07, and Ecflex-10 are suitable for ultra-flexible elastic epoxy adhesives. This product features adjustable elasticity and maintains excellent flexibility even at low temperatures. It exhibits silicone-like flexibility combined with epoxy bonding strength, corrosion resistance, and resistance to damp heat. EP-FL1 is a special-structure epoxy resin, while Ecflex-07 and Ecflex-10 are modified amine curing agents. The product contains no plasticizers.
Product Features
- Low-temperature elasticity
- Excellent resistance to thermal shock and heat aging
- High bonding strength
- Complies with REACH and ROHS requirements
Typical Product Properties
Typical Applications
- Electronic adhesives and electrical potting compounds requiring high resistance to thermal shock and damp heat aging
- Thermal conductive adhesives for automotive batteries, gap fillers for battery packs
Reference Formulation and Performance (Epoxy A/B two-component system available):
| Parameter | EP-FL1 | Ecflex-07 |
|---|---|---|
| Appearance | Colorless transparent liquid | Amber liquid |
| Viscosity at 25°C (mPa·s) | 5500 | 4200 |
| Mixing Ratio (mass ratio) | 100 | 65 |
| Curing Temperature | 120°C for 3 hours | |
| Pot Life @ 25°C | 2-3 hours | |
| Hardness Shore A (5s) | 42 |
Storage and Subsequent Treatment Methods
- Please refer to the MSDS
Shelf Life and Storage Conditions
- Minimum 24 months from the date of production
- Store in a sealed container in a cool, dark, and dry environment. Avoid prolonged exposure to air and moisture.
- Crystallization may occur at low temperatures. Heat to 60-80°C to melt before use; the product will function normally after melting.
